Eco-Friendly Fiberglass Continuous Filament Mat for Sustainable Solutions
Jiuding mainly offers four groups of CFM
CFM for Pultrusion
Description
CFM955 mat excels in pultrusion processes for profile manufacturing. This mat is known for its quick wet-through, strong wet-out capability, good conformability, smooth surface quality, and high tensile strength.
Features & Benefits
● This mat retains high tensile strength under high-heat conditions and when wetted with resin, supporting high-speed manufacturing and productivity requirements.
● Fast wet-through, good wet-out
● Easy processing (easy to split into various width)
● Outstanding transverse and random direction strengths of pultruded shapes
● Good machinability of pultruded shapes
CFM for Closed Molding
Description
Ideal for infusion, RTM, S-RIM and compression processes, CFM985 delivers superior resin flow characteristics. It effectively serves as either reinforcement material or as a flow-enhancing layer between fabric reinforcements.
Features & Benefits
● Outstanding resin flow characteristics.
● High wash resistance.
● Good conformability.
● Easy unrolling, cutting and handling.
CFM for Preforming
Description
CFM828 is ideally suited for preforming in closed mold process such as RTM (high and low- pressure injection), infusion and compression molding. Its thermoplastic powder can achieve high deformability rate and enhanced stretchability during preforming. Applications include heavy truck, automotive and industrial parts.
CFM828 continuous filament mat represents a large choice of tailored preforming solutions for closed mold process.
Features & Benefits
● Provide an ideal resin surface content
● Outstanding resin flow
● Improved structural performance
● Easy unrolling, cutting and handling
CFM for PU Foaming
Description
Optimized for PU foam reinforcement, CFM981's low binder content enables uniform distribution in expanding foam. Excellent for LNG insulation panels.
Features & Benefits
● Very low binder content
● Low integrity of the layers of the mat
● Low bundle linear density
